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Keywords =
Sn-6.5Zn solder alloy
Number of Articles:
1
Microstructure, creep deformation behavior and reliability of Sn-6.5wt%Zn-0.3wt%Cu lead free solder after Bi additions
Volume 52, Issue 2, April 2019, Pages
103-111
E. H. El-Khawas
View Article
PDF 884.33 K
View on SCiNiTO
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