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Arab Journal of Nuclear Sciences and Applications
Articles in Press
Current Issue
Journal Archive
Volume Volume 52 (2019)
Volume Volume 51 (2018)
Issue Issue 4
Issue Issue 3
Issue Issue 2
Mohamed, A. (2018). Creep behavior of β Cu-Zn Alloys. Arab Journal of Nuclear Sciences and Applications, 51(2), 124-136. doi: 10.21608/ajnsa.2017.1945.1007
Adel Zaki Mohamed. "Creep behavior of β Cu-Zn Alloys". Arab Journal of Nuclear Sciences and Applications, 51, 2, 2018, 124-136. doi: 10.21608/ajnsa.2017.1945.1007
Mohamed, A. (2018). 'Creep behavior of β Cu-Zn Alloys', Arab Journal of Nuclear Sciences and Applications, 51(2), pp. 124-136. doi: 10.21608/ajnsa.2017.1945.1007
Mohamed, A. Creep behavior of β Cu-Zn Alloys. Arab Journal of Nuclear Sciences and Applications, 2018; 51(2): 124-136. doi: 10.21608/ajnsa.2017.1945.1007

Creep behavior of β Cu-Zn Alloys

Article 15, Volume 51, Issue 2, April 2018, Page 124-136  XML PDF (1.8 MB)
Document Type: Original Article
DOI: 10.21608/ajnsa.2017.1945.1007
Author
Adel Zaki Mohamed email
Solid physics, Zagazig University
Abstract
Creep Behavior
Abstract:
Transient creep tests are performed under constant stress conditions at temperatures ranging from 533 to 653˚ K for Cu-38wt%Zn, and Cu-38wt%Zn-2wt% Pb samples. The transient creep is described by _tr= βt^n, where _tr and t are the transient creep strain and time. However, the parameters n, β are calculated, and the activation energy of the transient creep shows for both alloy two regions at low and high temperatures. Also, the activation energy were determined to clarify the controlling mechanism. At low temperature rang (240-360˚C), the strain rate sensitivity parameter m has values (0.247-0.174) while its values at high temperatures ranging from (0.192 up to 0.263) at 653˚K. These values give an indication that dislocation glide is probably an operating mechanism is grain boundary diffusion. Also, the change of microstructure was studied, grain size, microhardness, and stress-strain behavior has been studied too.

Keywords: Transient creep, Cu-Zn-Pb, lattice-diffusion, dislocations.
Keywords
Keywords: Transient creep; Cu-Zn-Pb; lattice-diffusion; dislocations
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