Effect of addition of GO Nanoparticles on the tensile properties and deformation temperature of Sn-3.5Ag-0.7Cu lead free solder alloy

The advantage of lead-liberated welding is the melting point of Sn-Ag-Cu (SAC) alloys in the Sn-rich alloy. The nanoparticles welding with lowering melting point near to the Sn-Pb eutectic point is found more interest. Latterly, the phase persistence of nanoparticles has been the project of massiveness of academic and experiential investigations. In this study, graphene nanoparticles (GNPa) with 0.3 percentages wt.% were successfully added into Sn-3.5Ag-0.7Cu lead-free solder. The effects of graphene nanoparticles (GNPa) on the microstructure, tensile properties, wettability, corrosion resistance, and hardness were subsequently investigated. The results show that graphene nanoparticles (GNPa) refine the microstructure with different features and enhance the wettability efficiently. Stress-strain tests discover that the combined solder with 0.3 wt.% GNPa exhibits about 15% and 25% enhancement in tensile strength and hardness, respectively. In addition, the total elongation of Sn-3.5Ag-0.7Cu is 22% greater than that of the pure Sn-3.5Ag-0.7Cu+0.3GO solder alloy. The enhancing mechanism of 0.3GO on the achievement of combined samples is also studied. Stress strain experiments were inspected under different five strain rates ranging from 5.4x10-5 S-1 to 2.9x10-3 S-1 and different five temperatures extended from R.T. (298K) to 383 K for two alloys. The activation enthalpy suggests that the dominant mechanism is the grain bounding diffusion (GBD). Also, X-ray diffraction examination display the permanence of both β-Sn rich phase and the intermetallic compound Ag3Sn and very little particles or residue from the intermetallic composition γ-In Sn4.